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Especially look for any (over) heat-related areas (they'll be obvious). With proper test gear, one can check component integrity on any power transistor or darlingtin pair topology. Component failure aside (and back to solder integrity issues)....HEAVY magnification is your friend......in the end,..just reflow anything that looks remotely suspect,..then test it (phase one). Component failure discussions are another matter/discussion.
I can only say (as many others already have), that a reflow of key, high power points would be inorder,...step one. Heat her up and start refowing as your heart desires,..just becareful of what wattage your using and tip size for the job....don't create any unwanted solder bridges.
"Big glob" will not do the job...be carefull,..flow it and get out of there,..keeping the heat there ONLY as long as you need it.
Hope it turns out to be a simple issue with a cold joint!
Best,
Doyle
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