It's a whopping 4x4 LGA package! I did the pcb design, so I've only myself to blame for it being there. I had some other bonehead do the assembly, but he cooked this device good and proper (and a few others). The pic is after I removed the dead device.
Like most things, to get them on it's all in the prep work. Clean between each step and use plenty of flux. Soldering iron used to 'bump' the pads on the package with solder, and localised hot air on both sides of the pcb to 'reflow' it back on. If you can get the position close (hence the microscope), these devices tend to self locate when the solder flows. This pcb's a prototype, so I designed the land pattern so that I could get it on manually. It'll be a slightly different land pattern for an automated process (if it goes that far). It's also a multilayer pcb with most of the internals being heat robbing copper planes - doesn't help the manual assembly process.
Manual hot air assembly devices are relatively cheap in comparison to mini reflow/IR ovens and paste machines.
